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Series of products for electronic industry
Suitable for thick film circuits, porous substrates and printed circuit boards, moisture-proof and static-resistant. PCB moisture-proof for LED lamps
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Product Details
Special purpose products (natural curing)
Series for the electronics industry-Product selection list
| Product Number | Then the material and the scope of application | Color | Viscosity (cp) | Preliminary Cure (min) /Complete Cure (hr) | Shear strength (N/mm2) | Temperature resistance range (℃) |
| 1120 | Suitable for thick film circuits, porous substrates and printed circuit boards, moisture-proof and static-resistant. PCB moisture-proof for LED lamps | yellow-green liquid | 650~950 | 25 ℃ / 7min / 72 | - | -45 ~ 200 |
| 1331 | PCB circuit board surface moisture-proof, antistatic coating glue, available spraying, soaking, brushing and other ways on the glue | Transparent (can be inspected with fluorescent lamps) | 300~350 | 10-15 / 24 | - | -55 ~ 125 |
| 29230B | Single-agent moisture-hardening early silane polymer, general-use type, fast curing, good adhesion to metal, plastic and rubber, impact resistance | Black | 135,000 | 7/24 | >30 | -60 ~ 120 |
| 29230C | Single-agent moisture-hardening early silane polymer, general-use type, fast curing, good adhesion to metal, plastic and rubber, impact resistance | Transparent | 135,000 | 7/24 | >30 | -60 ~ 120 |
| 29231 | Single agent silica gel, fast curing at room temperature, suitable for plastic and rubber | Black | 64,000~96,000 | 10/12 | >30 | -60 ~ 120 |
| 29231B | Single agent silica gel, fast curing at room temperature, suitable for a variety of materials with different thermal expansion coefficients. | Black | 64,000~96,000 | 10/12 | >30 | -60 ~ 120 |
| 29231BL | Solvent-free elastic adhesive, fast curing, suitable for a variety of materials with different thermal expansion coefficients. | Black | 16,000~24,000 | 10/12 | >30 | -60 ~ 120 |
| 29231C | Solvent-free elastic adhesive, fast curing, suitable for a variety of materials with different thermal expansion coefficients. | Yellowish translucent | 66,000~99,200 | 10/12 | >30 | -60 ~ 120 |
| 29231W | Solvent-free elastic adhesive, fast curing, suitable for a variety of materials with different thermal expansion coefficients. | White | 65,600~98,400 | 10/12 | >30 | -60 ~ 120 |
| 29232B | Single agent silica gel, fast curing at room temperature, no corrosion of electronic components, high voltage resistance | Black | 48,000~72,000 | 5/24 | >10 | -60 ~ 250 |
| 29232C | Single agent silica gel, fast curing at room temperature, no corrosion of electronic components, high voltage resistance | Transparent color | 48,000~72,000 | 5/24 | >10 | -60 ~ 250 |
| 29234 | Odorless, low shrinkage, fast curing, can be used to follow and seal, high strength follow | Black | 50,000- 100,000 | 5/24 | >15 | -60 ~ 232 |
| 29236 | Fast curing PU glue, multi-purpose, impact resistance | Transparent | 48,000~72,000 | 5/24 | >30 | -40 ~ 66 |
| 29237B | The new elastic polymer sealant has high adhesion properties and a wide range of applications, suitable for thin layer and surface cladding. | Black | 560,000~720,000 | 15~20/24 | >22 | -40 ~ 80 |
| 29238 | Room temperature curing, low odor, used for sealing and sealing, suitable for glass, metal, concrete and many building materials, non-corrosive metal | Transparent/white/black/gray/light gray/dark brown/aluminum gray | Paste | 10/48 | >4 | -48 ~ 149 |
| 3332 | Low fluidity, suitable for substrates and diodes, transistors, gate fluids, heat sinks, silicon-copper rectifiers and semiconductors, automatic thermostats, power resistors and heat sinks | White | Paste | No curing | - | -55 ~ 180 |
| 8764 | Double-agent acrylic adhesive, multi-purpose, impact resistance, high strength | gray white | 100,000 | Volume ratio = 1:1 10~12 / 24 |
>150 | -40 ~ 180 |
| 8765 | Double-agent acrylic adhesive, multi-purpose, impact resistance, high strength | gray white | 100,000 | Volume ratio = 1:1 20~25 / 24 |
>150 | -40 ~ 180 |
| 8766 | Two-type black Epoxy sealant, IC chip component packaging protection | Black | 40,000 | 30~90/24 | >210 | -55 ~ 120 |
| 8767 | Epoxy resin adhesive, A/B two-liquid type, easy to operate, suitable for infusion or surface coating of electronic parts industry | Black | 4,500~5,500 | Weight ratio = 4:1 35 |
>132 | -40 ~ 120 |
| 8775 | It has good operability, good toughness and disturbance after hardening, and can maintain a good state when potting electronic components, without any diffusion of vertical flow due to the heating and hardening process. | Main agent Milky White agent B slightly yellow | Main agent 16,000~26,000 Agent B <200 |
Weight ratio = 1:1 9/24 |
>150 | -40 ~ 120 |
| 9005-EC | Conductive silver adhesive, high viscosity, high conductivity, high thermal conductivity, suitable for LED chip | Silver | 10,400~13,000 | 80°C for 30min 175°C for 60mins | >80 | -40 ~ 250 |
| 9008-EC | Conductive silver adhesive, suitable for ITO glass, ITO film, glass substrate and metal, medium strength, high conductivity | Silver | 10,000~13,000 | 80°C for 30min~60min | >100 | -40 ~ 120 |
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