Epoxy resin series
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  • Epoxy resin series

Epoxy resin series

Litebang provides high-quality epoxy resins with the advantages of good heat resistance, high stability and easy processing. Epoxy resin, also known as artificial resin, resin glue, is a thermosetting plastic, widely used in adhesive, coating and other purposes. LETBOND®All kinds of high-quality epoxy resin can be used for electronic component bonding, PCB electronic component fixing, image module bonding, followed by metal, ceramic, heat-resistant plastic, PCB, etc., is your good helper in electronic component assembly. There is a demand for epoxy resin, please choose a variety of industrial adhesives.


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Product Details


Litebang provides high-quality epoxy resins with the advantages of good heat resistance, high stability and easy processing.
Epoxy resin, also known as artificial resin, resin glue, is a thermosetting plastic, widely used in adhesive, coating and other purposes. LETBOND®All kinds of high-quality epoxy resin can be used for electronic component bonding, PCB electronic component fixing, image module bonding, followed by metal, ceramic, heat-resistant plastic, PCB, etc., is your good helper in electronic component assembly.
There is a demand for epoxy resin, please choose a variety of industrial adhesives.
 

Product Features:
Depending on the product, they have the advantages of high temperature resistance, high strength, high viscosity, excellent thixotropy, durability, heavy work, and protection of the substrate. Please contact us.

Epoxy Series-Product Selection List

Product Number

Then the material and the scope of application

Color

Viscosity (cp)

Curing conditions

Hardness shore D

Save mode

3517

Good repair function of electronic components

Black

1,280~1,920

120°C/10min

D84

Refrigerate at 2 to 8°C

3530

E-book frame glue

Black

2,400~3,600

80~120°C/10~120min

D72

Refrigerate at 2 to 8°C

3544w

Secondary package bottom fill, applied to LED packaging

White

640~960

100~150°C/3~20min

D77

Refrigerate at 2 to 8°C

H3572L

Can be applied to the PCB on the electronic components fixed then

Black

68,000~110,000

130 °c/30min 150 °c/10min

D89

2 Refrigerated at 8°C

H3575

Can be applied to small gap underfill bottom filling, fast flow, can be heavy

Black

2,000~5,000

120°C/10min

D72

Refrigerate at 2 to 8°C

H3581

Good low temperature curing characteristics, suitable for fixing electronic components on PCB

Black

40,000~70,000

70 °c/45min 80 °c/30min

D68

Freezing at -40°C

3582

Apply to difficult materials then, such as LCPHoldermount

Black

180,000~240,000

80°C/5~10min

D86

Refrigerate at 2 to 8°C

3585

for DIE fixed

White

Shake denatured 1,672,000~2,508,000

80°C/30min

D68

Freezing at -20°C

3595-07

Can be heavy maintenance, low temperature curing, penetration speed

Black

700

100 °c/5min 90 °c/10min

83±2

Refrigerate at 2 to 8°C

3595-09

Can be heavy maintenance, low temperature curing, penetration speed

Black

900

100 °c/5min 90 °c/10min

83±2

Refrigerate at 2 to 8°C

3602-4

Suitable for metal, glass, plastic, etc

Yellow

Shake denaturation 90,000~110,000

80°C/60min

D78

Freezing at -20°C

3602-5

Suitable for metal, glass, plastic, etc

Yellow

Shake degeneration 119,600~196,000

80°C/60min

D78

Freezing at -20°C

3613

Batch coating, sealing and subsequent

Black

432,000~648,000

80~120°C/240min

D85

Refrigerate at 2 to 8°C

3618

Applied to the connector and flexible cable

Black

Shake denaturation 40,000~100,000

80°C/30min

D68

Freezing at -40°C

3620

Applied to PCB Batch

White

Shake degeneration 328,000~492,000

70~80°C/ 30~60min

D85

Freezing at -20°C

3630

Widely used in electronic products perfusion, caulking and packaging

Yellow

780~1200

80°C/30min

D80

Freezing at -20°C

RES08-B

High temperature resistance, high strength, can be followed by metal, ceramic, heat-resistant plastic, PCB, etc.

Black

Shake denaturation 36,000~42,000

150°C/40min

75±2

Refrigerate at 5~10°C


 

 

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