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Epoxy resin series
Litebang provides high-quality epoxy resins with the advantages of good heat resistance, high stability and easy processing. Epoxy resin, also known as artificial resin, resin glue, is a thermosetting plastic, widely used in adhesive, coating and other purposes. LETBOND®All kinds of high-quality epoxy resin can be used for electronic component bonding, PCB electronic component fixing, image module bonding, followed by metal, ceramic, heat-resistant plastic, PCB, etc., is your good helper in electronic component assembly. There is a demand for epoxy resin, please choose a variety of industrial adhesives.
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Product Details
Litebang provides high-quality epoxy resins with the advantages of good heat resistance, high stability and easy processing.
Epoxy resin, also known as artificial resin, resin glue, is a thermosetting plastic, widely used in adhesive, coating and other purposes. LETBOND®All kinds of high-quality epoxy resin can be used for electronic component bonding, PCB electronic component fixing, image module bonding, followed by metal, ceramic, heat-resistant plastic, PCB, etc., is your good helper in electronic component assembly.
There is a demand for epoxy resin, please choose a variety of industrial adhesives.
Product Features:
Depending on the product, they have the advantages of high temperature resistance, high strength, high viscosity, excellent thixotropy, durability, heavy work, and protection of the substrate. Please contact us.
Epoxy Series-Product Selection List
|
Product Number |
Then the material and the scope of application |
Color |
Viscosity (cp) |
Curing conditions |
Hardness shore D |
Save mode |
|
3517 |
Good repair function of electronic components |
Black |
1,280~1,920 |
120°C/10min |
D84 |
Refrigerate at 2 to 8°C |
|
3530 |
E-book frame glue |
Black |
2,400~3,600 |
80~120°C/10~120min |
D72 |
Refrigerate at 2 to 8°C |
|
3544w |
Secondary package bottom fill, applied to LED packaging |
White |
640~960 |
100~150°C/3~20min |
D77 |
Refrigerate at 2 to 8°C |
|
H3572L |
Can be applied to the PCB on the electronic components fixed then |
Black |
68,000~110,000 |
130 °c/30min 150 °c/10min |
D89 |
2 Refrigerated at 8°C |
|
H3575 |
Can be applied to small gap underfill bottom filling, fast flow, can be heavy |
Black |
2,000~5,000 |
120°C/10min |
D72 |
Refrigerate at 2 to 8°C |
|
H3581 |
Good low temperature curing characteristics, suitable for fixing electronic components on PCB |
Black |
40,000~70,000 |
70 °c/45min 80 °c/30min |
D68 |
Freezing at -40°C |
|
3582 |
Apply to difficult materials then, such as LCPHoldermount |
Black |
180,000~240,000 |
80°C/5~10min |
D86 |
Refrigerate at 2 to 8°C |
|
3585 |
for DIE fixed |
White |
Shake denatured 1,672,000~2,508,000 |
80°C/30min |
D68 |
Freezing at -20°C |
|
3595-07 |
Can be heavy maintenance, low temperature curing, penetration speed |
Black |
700 |
100 °c/5min 90 °c/10min |
83±2 |
Refrigerate at 2 to 8°C |
|
3595-09 |
Can be heavy maintenance, low temperature curing, penetration speed |
Black |
900 |
100 °c/5min 90 °c/10min |
83±2 |
Refrigerate at 2 to 8°C |
|
3602-4 |
Suitable for metal, glass, plastic, etc |
Yellow |
Shake denaturation 90,000~110,000 |
80°C/60min |
D78 |
Freezing at -20°C |
|
3602-5 |
Suitable for metal, glass, plastic, etc |
Yellow |
Shake degeneration 119,600~196,000 |
80°C/60min |
D78 |
Freezing at -20°C |
|
3613 |
Batch coating, sealing and subsequent |
Black |
432,000~648,000 |
80~120°C/240min |
D85 |
Refrigerate at 2 to 8°C |
|
3618 |
Applied to the connector and flexible cable |
Black |
Shake denaturation 40,000~100,000 |
80°C/30min |
D68 |
Freezing at -40°C |
|
3620 |
Applied to PCB Batch |
White |
Shake degeneration 328,000~492,000 |
70~80°C/ 30~60min |
D85 |
Freezing at -20°C |
|
3630 |
Widely used in electronic products perfusion, caulking and packaging |
Yellow |
780~1200 |
80°C/30min |
D80 |
Freezing at -20°C |
|
RES08-B |
High temperature resistance, high strength, can be followed by metal, ceramic, heat-resistant plastic, PCB, etc. |
Black |
Shake denaturation 36,000~42,000 |
150°C/40min |
75±2 |
Refrigerate at 5~10°C |
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